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ILX524KA
2700 pixel x 3 line CCD Linear Sensor (Color)
Description The ILX524KA is a reduction type CCD linear sensor developed for color image scanner. This sensor reads legal-size documents at a density of 300 DPI. Features * Number of effective pixels: 8100 pixels (2700 pixels x 3) * Pixel size: 8m x 8m (8m pitch) * Distance between line: 64m (8 Lines) * Single-sided readout * Ultra low lag / High sensitivity * Single 12V power supply * Input clock pulse: CMOS 5V drive * Number of output 3 (R, G, B) * Package: 22 pin Plastic-DIP (400 mil) Absolute Maximum Ratings * Supply voltage VDD 15 * Operating temperature -10 to +55 * Storage temperature -30 to +80 Pin Configuration (Top View)
Blue
22 pin DIP (Plastic)
Block Diagram
ROG-G
13
12
10
ROG-R
ROG-B
Driver
Driver
VDD
16
S2700
S2700
Read Out Gate
Read Out Gate
VOUT-R GND RS LH GND NC NC 1 NC
1
22 VOUT-G
CCD Register
CCD Register
4 5 6
19 NC 18 NC 17 NC
LH
4
R
G
B
Driver
VDD
7 8 9
16 VDD 15 2
20
VOUT-B 21
VOUT-G 22
14 NC 13 ROG-B
ROG-R 10
2700
2700
2700
GND 11
12 ROG-G
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
VOUT-R 1
E99619-PS
GND
2
RS
3
GND
5
D14
D15
D14 D15
D14 D15
3
20 VDD
CCD Register
2
21 VOUT-B
Read Out Gate
Green
1
1
1
Red
S2700
D64
D63 S1
D75
D64
D63 S1
D75
D75
V C C
2
15
Driver
1
8
D64 D63 S1
GND
11
ILX524KA
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol VOUT-R GND RS LH GND NC NC 1 NC ROG-R GND Description Signal out (red) GND Clock pulse input Clock pulse input GND NC NC Clock pulse input NC Clock pulse input GND Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol ROG-G ROG-B NC 2 VDD NC NC NC VDD VOUT-B VOUT-G Description Clock pulse input Clock pulse input NC Clock pulse input 12V power supply NC NC NC 12V power supply Signal out (blue) Signal out (green)
Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12.0 Max. 12.6 Unit V
Clock Characteristics Item Input capacity of 1, 2 Input capacity of LH Input capacity of RS Input capacity of ROG Symbol C1, C2 CLH CRS CROG Min. -- -- -- -- Typ. 400 10 10 10 Max. -- -- -- -- Unit pF pF pF pF
It indicates that ROG-R, ROG-G, ROG-B as ROG.
Clock Frequency Item 1, 2, LH, RS Symbol f1, f2, fLH, fRS Min. -- Typ. 1 Max. 5 Unit MHz
Input Clock Pulse Voltage Condition Item 1, 2, LH, RS, ROG pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V
-2-
ILX524KA
Electrooptical Characteristics (Note 1) Ta = 25C, VDD = 12V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm) Item Red Sensitivity Green Blue Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Green Blue Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Dynamic range Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE ZO VOS DR Min. 1.3 2.1 1.6 -- 2 0.74 0.46 0.58 -- -- -- -- 92 -- -- 1000 Typ. 2.0 3.2 2.5 4 3.2 1.6 1 1.28 0.3 1.5 0.02 26 98 250 6.5 10670 Max. 2.7 4.3 3.4 20 -- -- -- -- 2 5 -- 50 -- -- -- -- mV mV % mA % V -- Note 6 Note 6 Note 7 -- -- -- Note 8 Note 9 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks
Note 1) In accordance with the given electrooptical characteristics, the black level is defined as the average value of D2, D3 to D12. 2) For the sensitivity test light is applied with a uniform intensity of illumination. 3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT-G = 500mV (Typ.) PRNU = (VMAX - VMIN) /2 VAVE x 100 [%]
Where the 2700 pixels are divided into blocks of 100. The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4) Use below the minimum value of the saturation output voltage. 5) Saturation exposure is defined as follows. SE = VSAT R
Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6) Optical signal accumulated time int stands at 10ms. 7) VOUT-G = 500mV (Typ.) VOUT 8) Vos is defined as indicated bellow. VOUT indicates VOUT-R, VOUT-G, and VOUT-B. 9) Dynamic range is defined as follows. DR = VSAT VDRK
GND VOS
When the optical signal accumulated time is shorter, the dynamic range gets wider because the optical signal accumulated time is in proportion to the dark voltage. -3-
Clock Timing Chart 1
ROG
3 4 2775 D63 S1 S2 D13 D14 D62 D70 D61 S2700 D15 S2698 S2699
5
0
1 LH
5
0
2
5
0
D1
D2
D3
VOUT Optical black (49 pixels) Dummy signal (63 pixels) 1-line output period (2775 pixels)
Note) The transfer pulses (1, 2, LH) must have more than 2775 cycles.
ILX524KA
VOUT indicates VOUT-R, VOUT-G, VOUT-B.
D64
D65
D71
D75
-4-
RS
5
0
1
2
ILX524KA
Clock Timing Chart 2
t4 t5
ROG t2 t6 t7
1
t1
t3
2
Clock Timing Chart 3
t7 1 LH t6
2 t10 t9 RS t8 t13 VOUT t12 t11
-5-
ILX524KA
Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time /2 pulse fall time 1 pulse fall time /2 pulse rise time RS pulse high level period RS, LH pulse timing RS pulse rise time RS pulse fall time Signal output delay time Symbol Min. 50 800 800 0 0 0 0 45 45 0 0 -- -- Typ. 100 1000 1000 5 5 20 20 250 250 10 10 10 10 Max. -- -- -- 10 10 60 60 -- -- 30 30 -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13
These timing is the recommended condition under fRS = 1MHz.
-6-
Application Circuit
5.1k VOUT-B IC1 Tr1 100 2
5.1k
2
ROG-B
ROG-G
VOUT-G
Tr1
100
22 20
21
19 18 17 16 15 14 12
13
NC
NC
NC
2
VOUT-G
VOUT-B
VDD
VDD
NC
ROG-B
GND
NC
VOUT-R
NC
NC
RS
GND
1
LH
1 2 3 7 4 8
5
6
9
ROG-R
10
12V
100
100
100
2
0.1F
47F/16V IC1
Tr1
VOUT-R
5.1k RS LH
1
ROG-R
GND
11
ROG-G
-7-
IC1: 74AC04 Tr1 : 2SC2785
Data rate fRS = 1MHz. Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
ILX524KA
ILX524KA
Example of Representative Characteristics (VDD = 12V, Ta = 25C)
Spectral sensitivity characteristics (Standard characteristics)
1
0.8
Relative sensitivity
0.6
0.4
0.2
0 400
450
500
550 Wavelength [nm]
600
650
700
Dark signal output temperature characteristics (Standard characteristics)
Integration time output voltage characteristics (Standard characteristics)
10 5
Output voltage rate
Output voltage rate
1
1 0.5
0.5
0.1 0 10 20 30 40 50 60 Ta - Ambient temperature [C]
0.1 1 5 int - Integration time [ms] 10
Offset level vs. VDD characteristics (Standard characteristics)
12 Ta = 25C 10 10 12
Offset level vs. temperature characteristics (Standard characteristics)
VOS - Offset level [V]
8 6 4 2 0 11.4
VOS - Offset level [V]
8 6 4 2 0 VOS Ta -0.5mV/C
VOS VDD
0.3
12 VDD [V]
12.6
0
10
20
30
40
50
60
Ta - Ambient temperature [C]
-8-
ILX524KA
Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing plastic packages. a) Remain within the following limits when applying static load to the package. (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm
, , ,
Cover glass Plastic portion 39N 29N 29N 0.9Nm Ceramic portion (1) Adhesive (2) (3) (4)
,
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion. 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. -9-
ILX524KA
4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
- 10 -
Package Outline
Unit : mm
22pin DIP(400mil)
32.0 0.3
22
12
5.0 0.3
H 11
4.0 0.5
2.10
2.54 0.3
M
0.51
PACKAGE STRUCTURE
PACKAGE MATERIAL
Plastic , Ceramic
LEAD TREATMENT
GOLD PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE MASS
2.21g
ILX524KA
DRAWING NUMBER
LS-D10(E)
2.80 0.5
- 11 -
1. The height from the bottom to the sensor surface is 1.61 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
0.25
1
30.6
10.0 0.3
No.1 Pixel (Green)
10.16
V
9.0
0 to 9
6.53 0.3
21.6 (8mX2700Pixels)

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